Book Description:
This volume chronicles the proceedings of the International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, November 29 December 1, 1999. Polyimides constitute an important class of materials because of their many desirable traits, for example: low dielectric constant, high breakdown voltage, good planarization, wear resistance, radiation resistance, inertness to solvents, good adhesion properties, good hydrolytic stability, low thermal expansion, long term stability and excellent mechanical properties. This volume contains a total of 21 papers, all rigorously peer reviewed and revised before inclusion, addressing many aspects and new developments in polyimides and other high temperature polymers. The book is divided into two parts: Synthesis, Properties and Bulk Characterization'' and Interfacial or Adhesion Aspects and Applications''. The topics covered include: structure property relationships in polyimides; photochemistry and photophysics of polyimides; thermal and UV laser pyrolyses of polyimides; residual stress evaluation in polyimides; synthesis and characterization of a variety of polyimides; high T polyimide; fluorinated polyimides; highly oriented polyimide films; high temperature aromatic copolymer thermosets; shape memory polymers; polyimides as liquid crystal alignment layers; surface properties of polyimides; metal containing polyimides for optoelectronic applications; polyimide L B films; polyimides coated with copper sulfide; carbon fiber/polyimide composites; and simulations of the polyimide/silica interface. This volume offers a wealth of information and represents current commentary on the R&D activity taking place in the technologically highly important field of polyimides and other high temperature polymers and should be of value and interest to anyone interested in the fundamental or applied aspects of this topic.
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