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Microelectronic Yield, Reliability, and Advanced Packaging (Proceedings of Spie)
by Cher Ming Tan ; Yeng-kaung Peng ; Mali Mahalingam ; Krishnamachar Prasad
Binding: Paperback, 240 pages
Publisher: Society of Photo Optical
Weight: 0 pound
ISBN 10: 0819439010
ISBN 13: 9780819439017
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